Development of a Post-CMP Process for Cu/Low-k Devices
by Masako KODERA, Yukiko NISHIOKA, Hidekazu NAGANO, Tatsuo INOUE, & Katsuhiko TOKUSHIGE
A post-CMP (Chemical Mechanical Planarization) cleaning process for Cu/Low-k damascene devices has been developed which solves the problem of residues on Low-k films. Different cleaning solutions were used along with slurry to determine the optimal cleaning performance for Low-k (SiOC and spin-on MSQ), TEOS and Cu films. By this process, the line-to-line leakage Currents were found to be sufficiently low for the production of Cu/Low-k devices, suggesting a possibility that it could be used for cleaning Cu/Low-k LSI devices.
CMP, Copper (Cu), Low-k, Cleaning, Hydrophobic, LSI, Leakage current, Defect, Water mark
Electroless Plating Process for Cobalt Alloying Capping
by Xinming WANG, Daisuke TAKAGI, & Akira OWATARI
Selective depositing of thin cobalt alloy films as capping layers on Cu interconnects has already been proven to significantly and effectively improve EM performance, also as having a potential for reducing RC delay. A study had been made on the use of an electroless plating process for forming CoWP capping layers on wafer levels. Performance tests indicated satisfactory film thickness controllability, plating uniformity, barrier capability, surface morphology, deposition selectivity, as well as current leakage and resistance variation of interconnects. This process was thus proven as being feasible for use in wafer production.
Electroless plating, Cobalt alloy, Metal cap, Semiconductor, Copper interconnect, Deposition, Process, Reliability
Development of an Electron Beam Inspection System (EBeye)
by Tohru SATAKE, & Nobuharu NOJI
EBARA is now developing a novel electron beam inspection system, named EBeye, which features high speed and high resolution inspection for detecting defective microchips. The machine is capable of faster inspection than conventional SEM systems, enabled by the projection electron microscope (PEM) technique. The following introduces and discusses this system.
Defect, Inspection, Yield, Projection, Scanning electron microscope, Electron beam, Semiconductor, Process, Bright field, Dark field
Trends in Treatment of Gas Deriving from Semiconductor Manufacturing and EBARA's Development in such Treatment
by Masaaki OSATO
This report touches on transitions in the treatment of various hazardous gases deriving from semiconductor manufacturing processes, such as CVD and etching, as well as from LED manufacturing processes. Discussion on reduction and abatement methods is made. An introduction is also made on EBARA's development of optimal systems for the treatment of such gases, centering on PFCs and gases deriving from LED manufacturing.
Per-fluoro compounds, Global warming effect gas, Fired thermal type, Electrical thermal type with catalyst, Chemical reaction type for PFCs, Electrical thermal type, Chemical reaction and physical adsorption type, Decomposed gases by high temperature, Treatment of NOx, Wet treatment of hydrogen fluoride
Optical Endpoint Monitoring System for Oxide-CMP
by Shinrou OHTA, Shunsuke NAKAI, & Hitoshi TSUJI
An optical endpoint detection monitoring system for oxide-CMP has been developed. Multi-wave-length halogen lamps are used as the light source and optical paths are formed by applying D.I. water to the measured point while the polishing is in progress. Data processing makes use of both clear optical paths and the advantages carried by multi-wave-lengths, thus attaining stable monitoring wave forms which feature low-noise and minimized pattern structure influences. The following introduces and discusses system components and gives examples of actual usage in STI and ILD processes.
CMP, Endpoint detection, Oxide layer, Optical monitor, Multi-wave length, Water supply system, ILD-CMP, STI-CMP, Optical interference
Cu Interconnect Plating System
by Masao HODAI, Tsutomu NAKADA, & Hiroyuki KANDA
A Cu interconnecting plating system has been developed which constitutes EBR cleaning and plating cells. The process flow of this system includes wafer loading, pre-treatment, Cu deposition, solution recovery, DIW rinse/dry and wafer unloading. This system enables advanced plating performance and superior wafer uniformity. This system features many other advanced features and can be considered as a precursor of post-90 nm wafer plating systems.
Interconnect plating tool, Yield, Porous resistive element, Cathode, Anode, Plating solution, Overplate, Low acid, Bottom-up, Inert
Bump Plating System
by Fumio KURIYAMA, Yoshio MINAMI, & Masaaki KIMURA
The UFP-300A is a fully automatic bump-plating system released into the market in 2001. It features high quality bump plating and mass productivity. This system can also be used for rerouting, analog circuit boards and MEMS (Micro-Electro-Mechanical System). It is currently being used by leading-edge semiconductor manufacturers in the U.S.A. and Asia, as well as in Japan.
Bump, Plating, Electroplating, Wafer process, LSI, Chip mounting, Flip chip, Packaging, High-density packaging, Wafer level CSP (Chip Size Packaging)
Wafer Bevel Polishing System for Semiconductor Manufacturing Devices
by Mitsuhiko SHIRAKASHI, Kenya ITO, Ichiro KATAKABE, & Masunobu ONOZAWA
A new wafer bevel polishing system has been developed and released into the market. This system features improved cleaning performance of the backside of wafers as well as the buffing off of damage on and the removal of residual matter on the bevel. Also featured is the use of a polishing tape for bevel polishing.
Bevel, Notch, Polishing, Cleaning, SEMI, Polishing tape, Mini environment, Throughput
Dry Vacuum Pump Self-diagnosis System
by Tetsuro SUGIURA, Keiji TANAKA, & Tomoyuki YAMAZAKI
A self-diagnosis system has been developed in an effort to prevent abrupt stoppage of dry vacuum pumps used in semiconductor manufacturing. This system monitors electrical current changes in a vacuum pump and features an algorithm by which a warning signal is output when a predetermined electric current value is exceeded in a vacuum pump. This setup helps prevent stoppage due to the accumulation of reactive by-products inside the pumps. A self-diagnosis adaptor, capable of diagnostic computation and data storage, was also developed for use in existing central monitoring systems.
Dry vacuum pump, Self-diagnosis, Algorithm, Self-diagnosis adaptor, Peak current, Integral value, Central monitoring system, Lon-network, Pressure sensor, Warning set value
Development of a Corrosion and Wear Resistant Material
by Kenichi SUGIYAMA, Satoshi KAWAMURA, Hiroshi NAGASAKA, Katsuhiro MITSUHASHI, Toshiaki YASHIRO, & Tetsuya KONDO
Corrosion and wear resistant material for seawater handling, fluid machinery has been developed. This material is manufactured using an overlaying technique for enabling corrosion, erosion and abrasive wear resistance, and is superior in terms of cost-effectiveness, performance and repairability. Wear-resistant Co-based KV powder and crevice-corrosion-resistant Crevelloy constitute this material. Satisfactory hardness and corrosion resistance can be justified by the fact that the overlayer constitutes 15% mass VC, 35% mass Cr, 15% mass Mo and the rest Ni.
Built up welding, Overlayer, Wear resistance, Corrosion resistance, Slurry erosion, Cavitation, Stellite, Colmonoy, Tribaloy, Crevelloy
Development of Micro Brushless-DC Motor Pumps
by Yoshio MIYAKE, Yasutaka KONISHI, & Hiroshi UCHIDA
Two types of compact, brushless-DC canned motor pumps have been developed for use with various systems and equipment that are operated at flow rates of 3 L/min or less and under a total head of 10 m or below. Although there are many pumps in this class, namely positive displacement and turbo types, available in the market, there have been few that were compact and lightweight, and featuring high efficiency, long life, and low pulsation. Development of two pumps was carried out in parallel, that of a traditional centrifugal pump optimally configured to realize these concepts, and that of a gear pump for small flow rate application. These pumps are effective for use with compact systems and equipment which are operated long hours. Preparation is underway to release these pumps into the fuel cell, solar-energy-generation system, air conditioning and heat recovery system, and micro air-cooling system markets.
Brushless-DC, Centrifugal pump, Gear pump, Permanent magnet rotor, Neodymium, Low pulsation, Friction loss, Canned motor, Impeller, Micro-pump
Remote Monitoring and Control System for Yasumiyama Tunnel Ventilation System
by Atsushi NAKAYAMA, & Keisuke NAKAMOTO
A tunnel ventilation monitoring and control system for Yasumiyama Tunnel is introduced. This tunnel is a combined tunnel for both pedestrians and vehicles, thus necessitating control over exhaust gas and noise of vehicles, on top of controlling the emission of such gas for environmental protection. The following outlines this system.
Tunnel, Ventilation system, Remote monitoring, Control system, Emergency facilities
Construction of Haimeka Wristwatch Movement Components Manufacturing Facility
by Akira MASUI, & Masahiko KONNO
EBARA had undertaken the designing, construction and equipment installation of a wristwatch movement components manufacturing facility of Haimeka's Factory in Kagoshima Prefecture. This facility features minimal impact on the environment, energy saving, and excellent work efficiency. The facility's wastewater treatment system which evaporates drainage, surface-treatment process cooling system and electroplating are introduced and discussed.
Drainage system, Displacement ventilation, Ion-exchange process, Ultra-slow velocity spurt hole
Thermal Power Generation by Industrial Waste Incineration
by Katsuyuki KURIHARA
EBARA has developed an industrial-waste incineration system capable of thermal power generation. Noteworthy is that this system can also incinerate paper-mill-deriving PS-wastes, considered difficult to recycle, and used tires, whose illegal dumping is causing a social problem. The incineration of these two types of wastes alone generates 14000 kW, making this system the largest scale such system in Japan. This system features superior boiler characteristics, in terms of thermal efficiency, controllability and operability, equal to those of fossil fuel burning boilers.This system also features minimized pollution and superior feasibility, and is thus being used now in conjunction with existing power generation plants as a base load unit. It can also perform as a backup power source when the main power plant in a factory is shut down for periodical inspection. This large-capacity system is expected to revolutionize power generation by waste incineration.
Waste, Waste tire, Paper sludge, Power generation facility, Turbine, Boiler, Turbine bypass valve, Thermal efficiency, High temperature, Corrosion