Outstanding polish/removal performance using fixed abrasive
Device surface contact-free concept
Bevel profile control capability
Wide/flexible polishing area coverage
SEMI-S2/CE available
Model EAC is a bevel polishing system that removes defects and unneeded membranes by polishing the bevels on the edge of semiconductor wafers as well as the top edge and backside edge. Fixed abrasive allows for physical polishing without selection of polish target. Recipe-controllable polishing heads also enable high-precision control of the wafer edge shape.
Further improvement of production efficiency, high-performance & flexible CMP system
Achieves both high-throughput, high-speed plating and superior uniformity performance.
High performance, high throughput for high productivity.